A unique, 3D design and 3D analysis environment integrating Sigrity tools with Cadence Allegro technology provides a more efficient and less error-prone solution and uses third-party modelling tools, thereby cutting design cycle time and reducing risk. In addition, a new 3D Workbench methodology helps to bridge the gap between the mechanical and electrical domains, allowing product development teams to analyse signals that cross multiple boards quickly and accurately.
Since many high-speed signals cross PCB boundaries, effective signal integrity analysis needs to also encompass the signal source and destination die, as well as the intervening interconnect and return path including connectors, cables, sockets and other mechanical structures. Traditional analysis techniques have tended to use a separate model for each piece of interconnect and then cascade these models together in a circuit simulation tool. This can be an error-prone process due to the 3D nature of the transition from the PCB to the connector. In addition, since the 3D transition can make or break signal integrity, at very high speeds designers also want to optimise the transition from the connector to the PCB or the socket to the PCB.
The Sigrity 2018 release will enable designers to take a holistic view of their system, extending design and analysis beyond the package and board to also include connectors and cables. An integrated 3D design and 3D analysis environment allows PCB design teams to optimise the high-speed interconnect of PCBs and IC packages in the Sigrity tool and automatically implement the PCB and IC package interconnect in Allegro PCB, Allegro Package Designer, or Allegro SiP Layout without the need to redraw. By automating this process, the Sigrity 2018 release reduces risk, saves designers hours of re-drawing and re-editing and can save days of design cycle time by eliminating editing errors and potentially saves hundreds of thousands of pounds by avoiding re-spins and schedule delays.
A new 3D Workbench utility available with the Sigrity 2018 release bridges the mechanical components and the electronic design of PCB and IC packages, allowing connectors, cables, sockets and the PCB breakout to be modelled as one with no double counting of any of the routing on the board. Interconnect models are divided at a point where the signals are more 2D in nature and predictable. By allowing 3D extraction to be performed only when needed and fast, accurate 2D hybrid-solver extraction to be performed on the remaining structures before all the interconnect models are stitched back together, full end-to-end channel analysis can be performed efficiently and accurately of signals crossing multiple boards.
In addition, the release offers Rigid-Flex support for field solvers such as the Sigrity PowerSI technology, enabling robust analysis of high-speed signals that pass from rigid PCB materials to flexible materials.
Design teams developing Rigid-Flex designs can now use the same techniques previously used only on rigid PCB designs, creating continuity in analysis practices while PCB manufacturing and material processes continue to evolve.
“The Sigrity 2018 release takes a giant step forward by tightly coupling technology from multiple product teams at Cadence,” said Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence. “With the integration of 3D technology from the Allegro and Sigrity teams, we are enabling our customers to take a more holistic approach to product optimisation encompassing not only the chip, package and board but also the mechanical structures.”
Contact: William Lin
Add: No. 39,hot spring street, Gulou district, Fuzhou, Fujian province, China